| PART |
Description |
Maker |
| MB84VD22182EE-90-PBS MB84VD22184EE-90-PBS MB84VD22 |
32M (x 8/x16) FLASH MEMORY & 4M (x 8/x16) STATIC RAM
Stacked MCP (multi-chip package) flash memory & SRAM 32M(x8/x16) flash memory & 4M(x8/x16) static RAM
|
Fujitsu Microelectronics
|
| S70WS512N00BAWA30 S70WS512N000BAWA33 |
32M X 16 FLASH 1.8V PROM, 80 ns, PBGA84
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory
|
SPANSION LLC
|
| K5T6432YT K5T6432YTM-T310 |
64Mbit (4Mx16) four bank NOR flash memory / 32Mbit (2Mx16) UtRAM, 100ns
Multi-Chip Package MEMORY 64M Bit 4Mx16 Four Bank NOR Flash Memory / 32M Bit 2Mx16 UtRAM
|
Samsung Electronic
SAMSUNG[Samsung semiconductor]
|
| W3H32M72E-400ES W3H32M72E-XSBX W3H32M72E-400ESC W3 |
32M x 72 DDR2 SDRAM 208 PBGA Multi-Chip Package
|
WEDC[White Electronic Designs Corporation]
|
| DS42516 |
SPECIALTY MEMORY CIRCUIT, PBGA73
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
SPANSION LLC
ADVANCED MICRO DEVICES INC
|
| KAB04D100M-TNGP KAB01D100M KAB01D100M-TLGP KAB01D1 |
Multi-Chip Package MEMORY
|
SAMSUNG[Samsung semiconductor]
|
| M36L0T7050B2 M36L0T7050B2ZAQ M36L0T7050B2ZAQE M36L |
128 Mbit (Multiple Bank, Multi-Level, Burst) Flash memory and 32 Mbit (2Mb x16) PSRAM, Multi-Chip Package
|
Numonyx B.V
|
| K5C6481NTBM |
Multi-Chip Package MEMORY Data Sheet
|
Samsung Electronic
|
| K5P2880YCM |
Multi-Chip Package MEMORY 128M Bit 16Mx8 Nand Flash Memory / 8M Bit 1Mx8/512Kx16 Full CMOS SRAM
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| AM49DL640AG85IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
